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december 2008 rev 1 1/12 SATAULC6-2M6 sataulc6-2p6 ultra low capacitance esd protection features 2-line esd protection (at 15 kv air and contact discharge, exceeds iec 61000-4-2) protects v bus when applicable ultra low capacitance: 0.9 pf @ 825 mhz fast response time sot-666 and qfn packages rohs compliant benefits esd protection of v bus when applicable optimized rise and fall times for maximum data integrity large bandwidth to minimize impact on data signal quality consistent differential signal balance: ? ultra low impact on intra- and inter-pair skew ? matching high bit rate sata, dvi, hdmi and ieee 1394 requirements low pcb space occupation - 1.45 mm 2 for qfn low leakage current for longer operation of battery powered devices higher reliability offered by monolithic integration designed for go-through layout complies with these standards iec 61000-4-2 level 4 ? 15 kv air discharge ? 8 kv contact discharge mil std883g-method 3015-7 applications sata port up to 3 gb/s dvi and hdmi ports up to 1.65 gb/s ieee 1394a and b (firewire) ports up to 1.6 gb/s usb 2.0 ports up to 480 mb/s (hi-speed), backwards compatible with usb 1.1 low and full speed ethernet port: 10/100/1000 mb/s sim card protection video line protection portable electronics description the sataulc6-2x6 is a monolithic, application specific discrete device dedicated to esd protection of high speed interfaces. its very low line capacitance secures a high level of signal integrity. the device topology provides this integrity without compromising the complete protection of ics against the most stringent esd strikes. qfn (pin view) SATAULC6-2M6 sot-666 sataulc6-2p6 www.st.com
characteristics SATAULC6-2M6, sataulc6-2p6 2/12 1 characteristics figure 1. functional diagram table 1. absolute ratings symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 air discharge iec 61000-4-2 contact discharge mil std883g-method 3015-7 15 15 25 kv t stg storage temperature range -55 to +150 c t j maximum junction temperature 125 c t l lead solder temperature (10 seconds duration) 260 c table 2. electrical characteristics (t amb = 25 c) symbol parameter test conditions value unit min. typ. max i rm leakage current v rm = 5 v 0.5 a v br breakdown voltage between v bus and gnd i r = 1 ma 6 v v cl clamping voltage i pp = 1 a, t p = 8/20 s any i/o pin to gnd 12 v i pp = 5 a, t p = 8/20 s any i/o pin to gnd 19 v c i/o-i/o capacitance between i/o v r = 0 v, f = 825 mhz gnd not connected 0.45 pf c i/o-gnd capacitance between i/o and gnd v r = 0 v, f = 825 mhz any i/0 pin to gnd 0.9 pf c i/o-gnd capacitance variation between i/o and gnd v r = 0 v, f = 1 mhz 0.08 pf 1 6 2 5 3 4 i/o1 nc nc gnd v bus i/o2 1 16 2 5 3 4 i/o1 nc gnd v bus i/o2 nc qfn 6 leads sot-666
SATAULC6-2M6, sataulc6-2p6 characteristics 3/12 figure 2. line capacitance versus frequency (typical values) SATAULC6-2M6 figure 3. line capacitance versus frequency (typical values) sataulc6-2p6 c(pf) 0.00 0.20 0.40 0.60 0.80 1.00 1 10 100 1000 10000 vosc=30mvrms t j = 25 c v i-o/gnd = 0v v bus open c i/o - gnd c i/o ? i/o f(mhz) 0.00 0.20 0.40 0.60 0.80 1.00 1 10 100 1000 10000 c ( p f) vosc=30mvrms t j = 25 c v i-o/gnd = 0v v bus open c i/o - gnd c i/o ? i/o f(mhz) figure 4. attenuation (typical values) SATAULC6-2M6 figure 5. attenuation (typical values) sataulc6-2p6 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m300.0m 1.0g 3.0g -18.00 -15.00 -12.00 -9.00 -6.00 -3.00 0.00 io1 io2 4.8 ghz @ -3db f(hz) db 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m300.0m 1.0g 3.0g -15.00 -12.00 -9.00 -6.00 -3.00 0.00 io1 io2 f(hz) 4.6 ghz @ -3db db figure 6. eye diagram at 1.5 gbps pcb + SATAULC6-2M6 figure 7. eye diagram at 1.5 gbps pcb + sataulc6-2p6
characteristics SATAULC6-2M6, sataulc6-2p6 4/12 figure 8. eye diagram at 1.5 gbps pcb only figure 9. eye diagram at 3.0 gbps pcb only figure 10. eye diagram at 3.0 gbps pcb + SATAULC6-2M6 figure 11. eye diagram at 3.0 gbps pcb + sataulc6-2p6
SATAULC6-2M6, sataulc6-2p6 application example 5/12 2 application example figure 12. sata application using a go-through layout d1 smty12a d3 smty5.0a d5 sm2t3v3a d6 stps0520z r3 22 sataulc6-2x6 . i/o1 . i/o2 gnd 3 vbus 4 . 5 . 6 sataulc6-2x6 . i/o1 . i/o2 gnd 3 vbus 4 . 5 . 6 das_dss sata controller 3.3v 5v 12v r2 22 r1 22 j1 sata_connector s1/gnd 1 s2/a+ 2 s3/a- 3 s4/gnd 4 s5/b- 5 s6/b+ 6 s7/gnd 7 p1/v33 8 p2/v33 9 p3/v33p 10 p4/gnd 11 p5/gnd 12 p6/gnd 13 p7/v5p 14 p8/v5 15 p9/v5 16 p10/gnd 17 p11/das_dss 18 p12/gnd 19 p13/v12p 20 p14/v12 21 p15/v12 22
recommendation on pcb assembly SATAULC6-2M6, sataulc6-2p6 6/12 3 recommendation on pcb assembly 3.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness) figure 13. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio is 90%. figure 14. recommended stencil window position (qfn only) l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 250 m 650 m 620 m 236 m 15 m 15 m 7m 7m footprint stencil window footprint
SATAULC6-2M6, sataulc6-2p6 recommendation on pcb assembly 7/12 3.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20-45 m. 3.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 3.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
recommendation on pcb assembly SATAULC6-2M6, sataulc6-2p6 8/12 3.5 reflow profile figure 15. st ecopack? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max
SATAULC6-2M6, sataulc6-2 p6 package information 9/12 4 package information epoxy meets ul94, v0 in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 16. qfn 6 leads footprint dimensions in mm [inches] note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 3. micro qfn 1.45x1.00 6l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.50 0.55 0.60 0.020 0.022 0.024 a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 d 1.45 0.057 e 1.00 0.039 e 0.50 0.020 k 0.20 0.008 l 0.30 0.35 0.40 0.012 0.014 0.016 e d a a1 e b k l n 1 1 2 2 0.50 [0.020] 0.25 [0.010] 0.65 [0.026] 0.30 [0.012] 1.60 [0.063]
package information sat aulc6-2m6, sataulc6-2p6 10/12 figure 17. footprint (dimensions in mm) table 4. sot-666 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.60 0.018 0.024 a3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 0.27 0.34 0.007 0.011 0.013 d 1.50 1.70 0.059 0.067 e 1.50 1.70 0.059 0.067 e1 1.10 1.30 0.043 0.051 e 0.50 0.020 l1 0.19 0.007 l2 0.10 0.30 0.004 0.012 l3 0.10 0.004 d b l3 l1 e b1 e1 l2 e a a3 0.50 2.60 0.62 0.30 0.99
SATAULC6-2M6, sataulc6-2p6 ordering information 11/12 5 ordering information 6 revision history table 5. ordering information order code marking package weight base qty delivery mode SATAULC6-2M6 s (1) 1. the marking can be rotated by 90 to diferentiate assembly location qfn 6 leads 2.17 mg 3000 tape and reel sataulc6-2p6 u sot-666 2.99 mg 3000 tape and reel table 6. document revision history date revision changes 08-dec-2008 1 first issue
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